Release Films
Press Pads
Conformals
Contamination
Technical Help Desk
 
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P R O C E S S   S O L U T I O N S   F O R   S C R A P   R E D U C T I O N
 
Introduction

PACOTHANE TECHNOLOGIES has serviced the Printed Circuit Board Industry for over 30 years. We employ specialists in engineering, manufacturing and polymer chemistry who also are intimate with the knowledge of rigid and flexible circuit manufacturing complimenting the needs of PCB manufacturers. Our products remain up to date to consistently perform while offering an engineered resolution to your process related issues. Our solutions guide reflects typical challenges that our customers face matching the right Pacothane Product to each situation. We welcome your comments, requests and input so please contact us for any required information or special request.

 
PROCESS
PROBLEM
CAUSE
SOLUTION
 
Rigid Multilayer Lamination
  • "I want the smoothest surface possible without Any image transfer from my Release film used."
Texture from surface condition of the release film.
 

 
  • "I need a consistent residue free release film that offers low extraction values."
Manufacturing process of the release coating and base Film used.




   
  • Wrinkled or Wavy Copper
Excessive Shrinkage of Release film. Release film shrinkage draws the copper foil in, causing wrinkles.
 


   
  • Internal Mis-Registration
Uneven Pressure Distribution across the panel surface.
 


   
  • Localized Resin Starvation (Edge Frosting)
Excessive localized resin flow caused by extreme pressure imbalances across the panel surface.
 


   
  • Thickness Variation (Uncontrolled resin flow)
Variations in panel thickness due to uneven resin flow caused by inconsistent book heat rise.
 


   
  • Thickness Variation (Pressure Imbalance)
Center-to-edge thickness variation caused by excessive resin flow due to pressure imbalances.
 


   
  • Voiding in Low Pressure areas
Entrapped air/volatiles (voids) is caused by non-uniform and insufficient hydraulic pressure to push the air/volatiles out of the critical board area.
 


 
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  • Image/Glass Cloth Texture
Areas where the glass cloth is visible due to pressure imbalances.
 



 
Flexible Circuit Lamination
  • Entrapped Air
Failure of the make-up materials to provide close conformity to the part topography.
 

 
  • Adhesive Bleed Into Open Areas
Failure of conventional make-up materials to provide adequate conformity to flexible circuit board topography.
   

   
  • Adhesive Bleed into tight Tolerance areas with Low profile topography.
Failure of conventional make-up materials to Provide adequate conformity to flexible circuit board topography.
   

   
  • Adhesive Bleed into tight Tolerance areas with high Profile topography.
Failure of conventional make-up materials to Provide adequate conformity to flexible circuit board topography.
   

   
  • Internal Mis-registration (Flex Multilayer)
Unequal pressure distribution across the panel surface.
 


Contamination
  • False Alarms [Handling Damage]
Paper fiber and air-born contamination; minor scratched and trace imperfections, due to Handling Damage, causing alarms at AOI.
 

 
  • Poor Photoresist Adhesion
Oxidized Copper surface results in an unstable bond to the photoresist.
   

   
  • Surface Defects in Solder Mask
Scratches, chips and blemishes on cured Solder mask.
 
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