RELEASE PRODUCTS
PACO•CLUTCH™ NEW!
PRESS PADS
CONFORMABLES
CONTAMINATION CONTROL
ULTRA HIGH TEMPERATURE
THERMOPADS™ NEW!
THERMOFILM™ NEW!
EC Advance PCB Technology
Pacothane Technologies is pleased to announce a new relationship with ECAP - Now the exclusive distributor for Pacothane Proucts in China and Taiwan. We are excited to enter into this relationship with a great distributor to supply our world class product line. For questions, please contact Ch Lau at chlau@pacothane.com
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PROCESS SOLUTIONS:
Rigid Multilayer Lamination
"I want the smoothest surface possible without Any image transfer from my Release film used."
CAUSED BY: Texture from surface condition of the release film.
SOLUTION: PACOTHANE® HT 1500 SMOOTH
"I need a consistent residue free release film that offers low extraction values."
CAUSED BY: Manufacturing process of the release coating and base Film used.
SOLUTION: PACOTHANE® LE 2000
Wrinkled or Wavy Copper
CAUSED BY: Excessive Shrinkage of Release film. Release film shrinkage draws the copper foil in, causing wrinkles.
SOLUTION: PACOTHANE® HT 1500
Internal Mis-Registration
CAUSED BY: Uneven Pressure Distribution across the panel surface.
SOLUTION: PACOPADS™
Localized Resin Starvation (Edge Frosting)
CAUSED BY: Excessive localized resin flow caused by extreme pressure imbalances across the panel surface.
SOLUTION: PACOPADS™
Thickness Variation (Uncontrolled resin flow)
CAUSED BY: Variations in panel thickness due to uneven resin flow caused by inconsistent book heat rise.
SOLUTION: PACOPADS™
Thickness Variation (Pressure Imbalance)
CAUSED BY: Center-to-edge thickness variation caused by excessive resin flow due to pressure imbalances.
SOLUTION: PACOPADS™
Voiding in Low Pressure areas
CAUSED BY: Entrapped air/volatiles (voids) is caused by non-uniform and insufficient hydraulic pressure to push the air/volatiles out of the critical board area.
SOLUTION: PACOPADS™
Image/Glass Cloth Texture
CAUSED BY: Areas where the glass cloth is visible due to pressure imbalances.
SOLUTION: PACOPADS™
Flexible Circuit Lamination
Entrapped Air
CAUSED BY: Failure of the make-up materials to provide close conformity to the part topography.
SOLUTION: PACOTHANE® PLUS
Adhesive Bleed Into Open Areas
CAUSED BY: Failure of conventional make-up materials to provide adequate conformity to flexible circuit board topography.
SOLUTION: PACOTHANE® PLUS, PACOFLEX™ ULTRA
Adhesive Bleed into tight Tolerance areas with LOW profile topography.
CAUSED BY: Failure of conventional make-up materials to Provide adequate conformity to flexible circuit board topography.
SOLUTION: PACOFLEX™ ULTRA
Adhesive Bleed into tight Tolerance areas with HIGH profile topography.
CAUSED BY: Failure of conventional make-up materials to Provide adequate conformity to flexible circuit board topography.
SOLUTION: PACOTHANE® PLUS, PACOFLEX™ 10000
Internal Mis-registration (Flex Multilayer)
CAUSED BY: Unequal pressure distribution across the panel surface.
SOLUTION: PACOPADS™ & PACOTHANE® PLUS, PACOFLEX™ ULTRA, PACOFLEX™ 10000 for macro and micro Z-axis pressure distribution.
Contamination
False Alarms [Handling Damage]
CAUSED BY: Paper fiber and air-born contamination; minor scratched and trace imperfections, due to Handling Damage, causing alarms at AOI.
SOLUTION: PACOGARD™
Poor Photoresist Adhesion
CAUSED BY: Oxidized Copper surface results in an unstable bond to the photoresist.
SOLUTION: PACOGARD™
Surface Defects in Solder Mask
CAUSED BY: Scratches, chips and blemishes on cured Solder mask.
SOLUTION: PACOGARD™