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EC Advance PCB Technology

Pacothane Technologies is pleased to announce a new relationship with ECAP - Now the exclusive distributor for Pacothane Proucts in China and Taiwan. We are excited to enter into this relationship with a great distributor to supply our world class product line. For questions, please contact Ch Lau at

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Phone: 781-729-0927      Fax: 781-729-0929      
Blue Circuit Board

PACO•VIA™ 3000:




PACO•VIA™ 3000 is a two-sided release film designed to be part of a Two-Component System (PACO•VIA™ 3000 and PACOPADS™) as a performance-driven line of High-Temperature, Resin-Blocking Release Films. The PACO•VIA™ 3000 System is specifically engineered to enhance sequential lamination of Buried and Blind Via designed rigid printed Circuit Boards.


  • Resin Containment: PACO•VIA™ 3000 Resin-Blocking Film contains the resin within the via barrel eliminating the need for secondary processing to remove cured resin from the panel surface
  • Barrel Fill: PACO•VIA™ 3000 Resin Blocking Film allows the liquid resin to essentially fill the via Barrel
  • Contain Resin Squeeze-out: PACO•VIA™ 3000 contains resin squeeze-out like traditional release films while offering superior copper surface buffering from damaged Separator Plates
  • Equalization of Pressure throughout the Pressure Load: The PACOPADS™ component of the PACO•VIA™ 3000 System ensures complete barrel fill, and controlled Dielectric Thickness. PACOPADS™ eliminate air voids, inner-layer slippage and white corners or edges. PACOPADS™ also reduce image and glass cloth Transfer, and alleviate the potential of low-pressure prepreg Blisters


  • Two engineered Grades to fit all sequential lamination demands
  • Choice of PACOPADS™ Pressure Equalizing Press Pads designed to suit all lamination process parameters
  • Operating temperature of 425°F / 218°C for up to 4 hours
  • Essentially inert, no out-gassing, plate residue, interlaminate adhesion influence, no vacuum system contamination
  • Environmentally friendly: no chrome-depleting chemicals, no Fluorine’s
  • The PACO•VIA™ 3000 System is designed to contain the resin flow within Blind Via Holes (onto adjacent copper-carrying layers) and to fill buried Via Barrels, under a wide range of Lamination Pressures (175-350 psi/12-24 kg/cm2), Hole Diameters (.004 to .040"/0.1 to 1.0mm), Heat Rises and Prepreg types
  • The PACO•VIA™ 3000 System performs effectively well in Hydraulic and Hydraulic Vacuum-assist as well as with both stainless steel and aluminum Separator Plates. Steel is preferred
  • The PACO•VIA™ 3000 System is suitable for all resin system types when laminated within the listed temperature constraints


needs to be added.....

Recommended Lamination Layup for PACO•VIA™ 3000


Description of Standards for PACOVIA 3000


PACO•VIA™ 3000 Conformal Release Film is available in rolls and in custom-made sheet sizes, tooled to customer specifications. The complete line of Pacothane Technologies products is available from leading local Distributors Worldwide who offer "Just in Time" delivery from locally-available stocks.


Click here for this product's Safety Data Sheet (SDS).

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